الأجزاء الالكترونية : MR18R1622AF0

المصنع : Samsung semiconductor

التعبئة :

الدبابيس :

الوصف : (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die

درجة الحرارة : مين °C | ماكس °C

Datasheet : MR18R1622AF0 PDF

• MR18R16224DF0
• MR18R16228DF0
• MR18R1622AF0
• MR18R1622AF0-CK8
• MR18R1622AF0-CM8
• MR18R1622DF0
• MR18R1622GDF0
• MR18R16248EG0
• MR18R1624AF0
• MR18R1624AF0-CK8
• MR18R1624AF0-CM8
• MR18R1624AF1-CN9
• MR18R1624AF1-CT9
• MR18R1624EG0-CK8
• MR18R1624EG0-CM8