الأجزاء الالكترونية : BSM100GB170DN2

المصنع : Siemens Semiconductor Group

التعبئة :

الدبابيس :

الوصف : IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

درجة الحرارة : مين °C | ماكس °C

Datasheet : BSM100GB170DN2 PDF

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• BSM100GB120DN2K
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• BSM100GB170DLC
• BSM100GB170DN2